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Improvement of Economic Integration of Design with Process Capability Index
  • 所属机构名称：天津大学
  • 会议名称：Industrial Electronics and Applications, 2006 1ST IEEE Conference on
  • 成果类型：会议
  • 会场：哈尔滨
  • 相关项目：制造业六西格玛设计方法和应用研究
作者： 张志红|何桢|
同会议论文项目
制造业六西格玛设计方法和应用研究
期刊论文 149 会议论文 11
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