位置：成果数据库 > 会议 > 会议详情页
Surface damage analysis of KDP crystal grinding
  • 所属机构名称：哈尔滨工业大学
  • 成果类型：会议
  • 相关项目：各向异性软脆功能晶体高效精密和超精密加工技术基础
同会议论文项目
各向异性软脆功能晶体高效精密和超精密加工技术基础
期刊论文 56 会议论文 15 获奖 1
同项目会议论文
Chemical and Physical Characteristics of the Single Crystal Silicon Surface Polished by the Atmosphe
Viscosity Control System of MR Fluid Based on the Gray Forecast Control Algorithm 基于灰色预测控制算法的磁流变抛光液粘
A Vacuum Sucking Approach to Prevent Chips from Attaching to Machined Surface in Cutting of KDP Crys
Critical undeformed chip thickness and cutting pressure in relation to ductile mode cutting of KDP c
Anisotropy Analysis on Processed Surface of KDP Single Crystals
Research on the Deliquescent Polishing Technology for KDP Crystals
Magnetorheological Fluids Modeling: Without the No-Slip Boundary Condition 磁流变液剪切屈服应力建模
Ultra-precision Machining Technology of the Soft and Brittle Functional Crystal
Process Monitoring and Analysis in the Atmospheric Pressure Plasma Polishing (APPP) Method
Experimental Study on KDP Crystal Polishing
Study on removal and embedding mechanism of CdZnTe using loose abrasive
Experimental researches on precision grinding of KDP crystal
Influence of grinding to the surface and subsurface quality of KDP crystal
Polishing KDP Optical Crystals with Magnetorheological Finishing