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Fast electromagnetic modeling of 3D interconnects on chip-package-board
  • 所属机构名称：上海交通大学
  • 会议名称：Progress in Electromagnetics Research Symposium, PIERS 2010 Cambridge
  • 成果类型：会议
  • 会场：Cambridge, MA, United states
  • 相关项目：CMOS工艺下60GHz毫米波集成电路中三维（3D）传输线研究
作者： Chang, Xin|Mo, Tingting|Wu, Boping|Tsang, Leung|
同会议论文项目
CMOS工艺下60GHz毫米波集成电路中三维（3D）传输线研究
会议论文 12
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