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Capacitance-Voltage Characteristics of Symmetric Stacked Bonding Structure in 3D Integration
  • 所属机构名称：南京邮电大学
  • 会议名称：CSTIC2014
  • 时间：2014.3.3
  • 成果类型：会议
  • 相关项目：SOI功率器件横向变厚度耐压新技术的机理、工艺和模型研究
作者： Li man|Guo Yufeng|Lin Hong|JI Xincun|Xia Xiaojuan|Wang bin|
同会议论文项目
SOI功率器件横向变厚度耐压新技术的机理、工艺和模型研究
期刊论文 49 会议论文 25 专利 18
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