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A Phase-Change Memory SPICE Model Adaptable to Different Device Geometry
  • 所属机构名称：北京大学
  • 会议名称：2014 IEEE International Conference on Electron Devices and Solid-State Circuits
  • 时间：2014.6.18
  • 成果类型：会议
  • 相关项目：相变存储器件OTS与OMS物理机理和模型研究
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相变存储器件OTS与OMS物理机理和模型研究
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