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Migration of sintered nanosilver die-attach material on alumina substrate at high temperatures
  • 所属机构名称：天津大学
  • 会议名称：2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, IC
  • 时间：2011
  • 成果类型：会议
  • 相关项目：高温功率电子封装用新型绿色芯片粘接材料的电迁移行为及理论研究
作者： Mei, Yunhui|Ibitayo, Dimeji|Chen, Xu|Luo, Susan|Lu, Guo-Quan|
同会议论文项目
高温功率电子封装用新型绿色芯片粘接材料的电迁移行为及理论研究
期刊论文 27 会议论文 6
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