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Thermalcharacteristics simulation of semiconductor lasers packaging for high speedapplication
  • 所属机构名称：华中科技大学
  • 会议名称：15th International Conference on Electronic Packaging Technology (ICEPT)
  • 时间：2015.8
  • 成果类型：会议
  • 相关项目：SGDBR可调谐半导体激光器及相关集成器件的热效应研究
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SGDBR可调谐半导体激光器及相关集成器件的热效应研究
期刊论文 7 会议论文 10
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