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Improvement of Manufacturing Process forMultilayer Substrate Integrated Waveguide
  • 所属机构名称：电子科技大学
  • 会议名称：, 15th International Conference on Electronic Packaging Technology (ICEPT)
  • 时间：2014.8
  • 成果类型：会议
  • 相关项目：行波再生反馈振荡非线性跳频与多模机理研究
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行波再生反馈振荡非线性跳频与多模机理研究
期刊论文 27 会议论文 13
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