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高温服役对纳米银焊膏封装接头力学性能的影响
  • 所属机构名称：清华大学
  • 会议名称：第17届全国焊接学术会议暨第19届全国钎焊及特种连接技术交流会
  • 时间：2012.10.10
  • 成果类型：会议
  • 相关项目：纳米Ag膏及其用于高温电子封装的低温烧结连接技术与机理
作者： 林路禅|闫剑锋|LIU Lei|邹贵生|吴爱萍|白海林|闫久春|ZHOU Yunhong|
同会议论文项目
纳米Ag膏及其用于高温电子封装的低温烧结连接技术与机理
期刊论文 19 会议论文 27
同项目会议论文
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微连接和纳连接研究新进展
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含镀银铜粉的微米氧化银混合焊膏用于封装连接研究.
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