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A micro- semiconductor tactile sensor for the automatic obstacle-avoidance system of endoscope.
  • 所属机构名称：上海大学
  • 会议名称：Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure An
  • 作者或编辑：3448
  • 第一作者单位：Shanghai Univeristy
  • 语言：英文
  • 成果类型：会议
  • 相关项目：智能纤维镜无操作自动快速介入和可视化
作者： Shen Linyong|Qian Jinwu|Zhang Zhen|Zhang Yanan|Yin Jinxi|
同会议论文项目
智能纤维镜无操作自动快速介入和可视化
期刊论文 14 会议论文 7
同项目会议论文
FBG Sensor Device for Spatial Shape Detection of Intelligent Colonoscope
The Perforation-avoidance Endoscope System Based on Micro-semicondutor Tactile Sensor
On SDM/WDM FBG Sensor Net for Shape Detection of Endoscope,
Configuration Design of A Robotic Colonoscopic System,
Active Insertion for a Robotic Endoscope,
Research on Visualization of Robotic Endoscope Body in Examination