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Thermal deformation anaysis of Flip chip on board package by digital image correlation technique,
  • 所属机构名称：北京大学
  • 会议名称：Proc. 5th Int. Conf. on EMAP,2003,
  • 语言：英文
  • 成果类型：会议
  • 相关项目：实验固体力学
作者： Li M.|.Zhang J|Xiong C.Y|Fang J|
同会议论文项目
实验固体力学
会议论文 13 著作 1
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