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Simulation analysis of the fine pitch micro-bump formation with solder injection method
  • 所属机构名称：中国科学院微电子研究所
  • 会议名称：2015 16th International Conference on Electronic Packaging Technology (ICEPT)
  • 时间：2015.8
  • 成果类型：会议
  • 相关项目：三维集成电路超细节距微钎料凸点互连研究
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三维集成电路超细节距微钎料凸点互连研究
期刊论文 6 会议论文 6
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