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The Dynamic Stress Intensity Factor Analysis of Adhesive Bonded Material Interface with Damage under
  • 所属机构名称：大连理工大学
  • 会议名称：16TH INTERNATIONAL CONFERENCE ON COMPOSITE MATERIALS (ICCM-16)
  • 成果类型：会议
  • 会场：Kyoto, Japan
  • 相关项目：夹芯复合材料界面裂纹动态起裂和扩展机理的跨尺度研究
作者： Cai Yanhong|Chen Haoran|Sun Shiyong|
同会议论文项目
夹芯复合材料界面裂纹动态起裂和扩展机理的跨尺度研究
期刊论文 17 会议论文 14
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