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Solderability of Ni, Fe elemental and alloy platings by SnAgCu
  • 所属机构名称：中国科学院金属研究所
  • 成果类型：会议
  • 相关项目：人造微纳结构上锡钎料的润湿特性
同会议论文项目
人造微纳结构上锡钎料的润湿特性
期刊论文 5 会议论文 5
同项目会议论文
Dependence of Wetting Temperature on the Solder/ Substrate Oxidation in a Reductive Atmosphere
A Numerical Simulation Study on Wetting and Bridging of SnAgCu Solder Liquid
Avoid solder bridging: Dewetting of SnAgCu solder liquid on non-wetting zone
Effect of copper oxide layer on solder wetting temperature under a reduced atmosphere