位置：成果数据库 > 会议 > 会议详情页
Experimental Study of SiC Ceramic Grinding Subsurface Cracks
  • 所属机构名称：哈尔滨工业大学
  • 会议名称：The 10th CHINA-JAPAN International Conference on Ultra- Precision Machining Process(CJUMP)
  • 时间：2014.11.10
  • 成果类型：会议
  • 相关项目：基于磨粒动态冲击效应的光学玻璃磨削亚表面裂纹生成机理研究
同会议论文项目
基于磨粒动态冲击效应的光学玻璃磨削亚表面裂纹生成机理研究
期刊论文 13 会议论文 9
同项目会议论文
Grinding Force and Surface Roughness in Ultrasonic Assisted Grinding of SiC Ceramics with Diamond Gr
Experimental study on impact scratching of single abrasive for K9 glass
Simulation analysis of grinding wheel motion trajectory on SiC ceramics aspheric surface grinding
Study on Subsurface Crack of Vickers Indentation andScratch Tests of Silicon Carbide Ceramics
光学玻璃单颗磨粒磨削动态冲击效应数值仿真研究
K9 玻璃磨削亚表面损伤深度预测模型及实验研究
Research on the laws of wear rate of the grinding block in grinding SiC
Study on subsurface crack for Vickers indentation and scratch tests of silicon carbide ceramics