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Tribo-electric behaviors of copper under dry sliding against Cu-Cr alloys
  • 所属机构名称：河南科技大学
  • 会议名称：STLE/ASME 2010 International Joint Tribology Conference, IJTC2010
  • 成果类型：会议
  • 相关项目：载流摩擦副导电/摩擦接触行为的耦合关联途径与复合损伤机制研究
作者： Shangguan, Bao1, 2|Zhang, Yongzhen2|Xing, Ji|ong1|
同会议论文项目
载流摩擦副导电/摩擦接触行为的耦合关联途径与复合损伤机制研究
期刊论文 47 会议论文 6 专利 6 著作 1
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