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A novel approach to fabricate 3-dimensional carbon-based interconnect for micro/nano optoelectronic
  • 所属机构名称：湖北工业大学
  • 会议名称：Photonics and Optoelectronics Meetings (POEM) 2008: Optoelectronic Devices and Integration
  • 成果类型：会议
  • 会场：Wuhan, China
  • 相关项目：面向三维集成器件封装的无焊料高密度通孔垂直互连技术研究
作者： Jie, Gong|Tielin, Shi|Ping, Peng|Yuanyuan, Yaoa|Guanglan, Liao|Zirong, Tang|
同会议论文项目
面向三维集成器件封装的无焊料高密度通孔垂直互连技术研究
期刊论文 15 会议论文 6 专利 6
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