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Anodic bonding technology of slender glass tube and silicon in pressure sensor packaging
  • 所属机构名称：苏州大学
  • 会议名称：2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013
  • 时间：2013
  • 成果类型：会议
  • 相关项目：基于主动动态粘着控制的微尺度对象操作机理及方法研究
作者： Chen, Tao|Sun, Lining|Pan, Mingqiang|Wang, Yangjun|Liu, Jizhu|Chen, Liguo|
同会议论文项目
基于主动动态粘着控制的微尺度对象操作机理及方法研究
期刊论文 13 会议论文 9 专利 3
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Anodic bonding technology of slender glass tube and silicon in pressure sensor packaging
Anodic bonding technology of slender glass tube and silicon in pressure sensor packaging
Anodic bonding technology of slender glass tube and silicon in pressure sensor packaging