位置：成果数据库 > 会议 > 会议详情页
Model reduction for the electrostatically actuated silicon diaphragm based on modal-type dynamic con
  • 所属机构名称：福州大学
  • 会议名称：Proceedings of the ASME 2014 International Mechanical Engineering Congress and Exposition(IMECE2014)
  • 时间：2014.11
  • 成果类型：会议
  • 相关项目：覆膜基底与微悬臂梁间粗糙面重复冲击接触－分离的动态接触特性分析
同会议论文项目
覆膜基底与微悬臂梁间粗糙面重复冲击接触－分离的动态接触特性分析
期刊论文 28 会议论文 5
同项目会议论文
The Influence of Velocity Variation on the Adhesive Contact Behavior and the Deformation of Substrat
Analysis of plastic strain between substrate and micro-cantilever under different deformation charac
ANALYSIS OF CONTACT AREA BETWEEN AN ELASTO-PLASTIC ROUGH BODY AND A FLAT BODY UNDER DIFFERENT WORKI
与基底接触-分离过程中微悬臂梁的动态应力分析