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Avoid solder bridging: Dewetting of SnAgCu solder liquid on non-wetting zone
  • 所属机构名称：中国科学院金属研究所
  • 成果类型：会议
  • 相关项目：人造微纳结构上锡钎料的润湿特性
同会议论文项目
人造微纳结构上锡钎料的润湿特性
期刊论文 5 会议论文 5
同项目会议论文
Dependence of Wetting Temperature on the Solder/ Substrate Oxidation in a Reductive Atmosphere
A Numerical Simulation Study on Wetting and Bridging of SnAgCu Solder Liquid
Solderability of Ni, Fe elemental and alloy platings by SnAgCu
Effect of copper oxide layer on solder wetting temperature under a reduced atmosphere