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Research on feature extraction for chip resistors defect based on PCA
  • 所属机构名称：苏州大学
  • 会议名称：2012 International Workshop on Image Processing and Optical Engineering
  • 时间：2011
  • 成果类型：会议
  • 相关项目：基于主动动态粘着控制的微尺度对象操作机理及方法研究
作者： Pan, M.Q.|Chen, L.G.|Chen, T.|Zhao, M.X.|Wang, Z.H.|
同会议论文项目
基于主动动态粘着控制的微尺度对象操作机理及方法研究
期刊论文 13 会议论文 9 专利 3
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Anodic bonding technology of slender glass tube and silicon in pressure sensor packaging
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