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Iterfacial wetting behavior under low-density ultrasonic field and solvent-assisted
  • 所属机构名称：东北大学
  • 会议名称：2014 4th International Symposium on Chemical Engineering and Material Properties (ISCEMP 2014),
  • 时间：2014.6.28
  • 成果类型：会议
  • 相关项目：超声场耦合作用下C/Al界面润湿与传质行为
同会议论文项目
超声场耦合作用下C/Al界面润湿与传质行为
期刊论文 13 会议论文 5 专利 1
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