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Fine grain 3D integration for microarchitecture design through cube packing exploration
  • 所属机构名称：清华大学
  • 会议名称：2007 IEEE International Conference on Computer Design, ICCD 2007
  • 成果类型：会议
  • 会场：Lake Tahoe, CA, United states
  • 相关项目：面向时序设计的布图规划算法研究
作者： Ma, Yuchun|Liu, Yongxiang|Reinman, Glenn|Cong, Jason|Kursun, Eren|
同会议论文项目
面向时序设计的布图规划算法研究
期刊论文 2 会议论文 34 获奖 1 专利 2
同项目会议论文
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Voltage island aware incremental floorplanning algorithm based on MILP formulation
Design space exploration for 3D integrated circuits
LP based white space redistribution for thermal via planning and performance optimization in 3D ICs