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A Study on The Low Temperature Sintering-Bonding through In-Situ Formation of Ag Nanoparticles Using
  • 所属机构名称：清华大学
  • 会议名称：2011 International Conference on Electronic Packaging Technology & High Density Packaging
  • 时间：2011.8.8
  • 成果类型：会议
  • 相关项目：纳米Ag膏及其用于高温电子封装的低温烧结连接技术与机理
作者： Fengwen Mu|Guisheng Zou|Jianfeng Yan|Hailin Bai|Aiping Wu|
同会议论文项目
纳米Ag膏及其用于高温电子封装的低温烧结连接技术与机理
期刊论文 19 会议论文 27
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