位置：成果数据库 > 会议 > 会议详情页
Investigation of the stress-strain curves of lead-free solder alloy
  • 所属机构名称：太原理工大学
  • 会议名称：EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Exp
  • 成果类型：会议
  • 会场：Freiburg im Breisgau, Germany
  • 相关项目：无铅焊料电子封装芯片动力失效模式及相关力学问题的实验与理论研究
作者： Yong, Ma|Guitong, Yang|Zhigang, Li|Xiaoyan, Niu|Xuefeng, Shu|
同会议论文项目
无铅焊料电子封装芯片动力失效模式及相关力学问题的实验与理论研究
期刊论文 9 会议论文 12
同项目会议论文
Unstable void growth in thermohyperelastic plastic IC packaging material due to thermal load and vap
The study of moisture induced vapor pressure and weakened interfacial strength in CSP packages
Hygrother-mal mechanical analysis of a Flip Chip Package by finite element method
Delamination in thermohyperelastic plastic IC packaging material due to thermal load and moisture
Characterization of creep properties of zeolite molecular sieves using nanoindentation test
Modeling solder joint reliability of VFBGA packages under board level drop test based on dynamic con
Dynamic constitutive relation of EMC over a broad range of temperatures and strain rates
Effects of strain rate and temperature on mechanical behavior of SACB solder alloy
Cavitation instability in Valanis-Landel hyperelastic IC packaging material
Cavitation instability in the plastic IC packaging material due to moisture-induced vapor pressure a
Moisture absorption and void growing effects on failure of electronic packaging