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A High Efficient On-Chip Interconnection Network in SIMD CMPs
  • 所属机构名称：华中科技大学
  • 会议名称：10th International Conference on Algorithms and Architectures for Parallel Processing
  • 成果类型：会议
  • 相关项目：面向三维堆叠封装的芯片间电感耦合无线互联技术研究
作者： Wu, Dan|Dai, Kui|Zou, Xuecheng|Rao, Jinli|Chen, Pan|
同会议论文项目
面向三维堆叠封装的芯片间电感耦合无线互联技术研究
期刊论文 36 会议论文 7 专利 2
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