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The study of moisture induced vapor pressure and weakened interfacial strength in CSP packages
  • 所属机构名称：太原理工大学
  • 会议名称：The 5th International Conference on Nonlinear Mechanics
  • 成果类型：会议
  • 会场：Shanghai, China
  • 相关项目：无铅焊料电子封装芯片动力失效模式及相关力学问题的实验与理论研究
作者： Li Zhigang , Niu Xiaoyan, Shu Xuefeng|
同会议论文项目
无铅焊料电子封装芯片动力失效模式及相关力学问题的实验与理论研究
期刊论文 9 会议论文 12
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