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Low temperature direct bonding technology for wafer-scale integration and packaging
  • 所属机构名称：华中科技大学
  • 会议名称：3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008
  • 成果类型：会议
  • 会场：Sanya, China
  • 相关项目：高深宽比微纳层次结构的仿壁虎毛参数优化设计与制作工艺研究
作者： Liao, Guanglan|Tang, Zirong|Shi, Tielin|Nie, Lie|Peng, Ping|Liu, Shiyuan|
同会议论文项目
高深宽比微纳层次结构的仿壁虎毛参数优化设计与制作工艺研究
期刊论文 20 会议论文 12 专利 1
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