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一种高集成度可编程分频器
  • 所属机构名称：南京邮电大学
  • 会议名称：第二十四届中国电子学会电路与系统分会学术年会
  • 时间：2013.5.5
  • 成果类型：会议
  • 相关项目：SOI功率器件横向变厚度耐压新技术的机理、工艺和模型研究
作者： 郑立博|张长春|郭宇锋|
同会议论文项目
SOI功率器件横向变厚度耐压新技术的机理、工艺和模型研究
期刊论文 49 会议论文 25 专利 18
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