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Metal–metal bonding process using copper nanoparticle paste prepared by ployol method
  • 所属机构名称：清华大学
  • 会议名称：The Program of Annual Meeting of Select Committee (SC) MICRO,65th Annual Assembly & Internationa
  • 时间：2012.7.7
  • 成果类型：会议
  • 相关项目：纳米Ag膏及其用于高温电子封装的低温烧结连接技术与机理
作者： Y. Norman Zhou|Jianfeng Yan|Yingchuan Zhang|Luchan Lin|Aiping Wu|Jialie Ren|Jiuchun Yan|Anming Hu|Lei Liu|
同会议论文项目
纳米Ag膏及其用于高温电子封装的低温烧结连接技术与机理
期刊论文 19 会议论文 27
同项目会议论文
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微连接和纳连接研究新进展
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纳米银与纳米铜混合焊膏用于电子封装低温烧结连接
含镀银铜粉的微米氧化银混合焊膏用于封装连接研究.
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