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Vacuum micro-electroforming technique for the production of void-free microcomponent
  • 所属机构名称：南京航空航天大学
  • 会议名称：3rd International Conference on Engineering and Technologies and Ceeusro, ICETC2009
  • 成果类型：会议
  • 会场：Changzhou, Jiangsu, China
  • 相关项目：微细电加工及其微小装备的基础研究
作者： Zhu, D.|Ming, P.M.|Hu, Y.Y.|Zhou, F.|
同会议论文项目
微细电加工及其微小装备的基础研究
期刊论文 71 会议论文 11 获奖 1 专利 13 著作 2
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