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A design of transition between microstrip line and semiconductor devices with gold-bonding wire
  • 所属机构名称：电子科技大学
  • 会议名称：2011 4th IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wi
  • 成果类型：会议
  • 相关项目：可重构异向介质的实现机理及特性研究
作者： Ma, T.Y.|Jiang, Y.|Lin, X.Q.|Zhu, Z.B.|Fan, Y.|
同会议论文项目
可重构异向介质的实现机理及特性研究
期刊论文 13 会议论文 10 专利 7
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