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Analysis of stress and strain distribution on pad during bump bonding process
  • 所属机构名称：桂林电子科技大学
  • 会议名称：Proceedings of the Electronic Packaging Technology Conference, EPTC. IEEE, 2014
  • 时间：2014.10.13
  • 成果类型：会议
  • 相关项目：云制造环境下多粒度服务访问控制方法研究
同会议论文项目
云制造环境下多粒度服务访问控制方法研究
期刊论文 23 会议论文 7 专利 1 著作 1
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