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Research on TSV positioning in 3D IC placement
  • 所属机构名称：北京工业大学
  • 会议名称：2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011
  • 成果类型：会议
  • 相关项目：低功耗集成多级放大器的设计研究
作者： Hou, Ligang1|Bai, Shu1|Wang, Jinhui1|
同会议论文项目
低功耗集成多级放大器的设计研究
期刊论文 38 会议论文 35 专利 10
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