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Modeling solder joint reliability of VFBGA packages under board level drop test based on dynamic con
  • 所属机构名称：太原理工大学
  • 会议名称：2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-H
  • 成果类型：会议
  • 会场：Beijing, China
  • 相关项目：无铅焊料电子封装芯片动力失效模式及相关力学问题的实验与理论研究
作者： Li, Zhigang|Niu, Xiaoyan|Chen, Tong|Shu, Xuefeng|
同会议论文项目
无铅焊料电子封装芯片动力失效模式及相关力学问题的实验与理论研究
期刊论文 9 会议论文 12
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