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The mathematical model and simulation for a micro electromagnetic relay
  • 所属机构名称：北京工业大学
  • 会议名称：2009 IEEE International Conference on Mechatronics and Automation, ICMA 2009
  • 成果类型：会议
  • 会场：Changchun, China
  • 相关项目：显微投影SLM立体视觉测量法用于微结构3D形貌重构的机理研究
作者： Liu, Bendong|Li, Desheng|Yang, Jiahui|Wang, Yuezong|
同会议论文项目
显微投影SLM立体视觉测量法用于微结构3D形貌重构的机理研究
期刊论文 8 会议论文 8 专利 2 著作 1
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