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Rethinking Thermal Via Planning with Timing-Power-Temperature Dependence for 3D ICs
  • 所属机构名称：清华大学
  • 会议名称：16th Asia and South Pacific Design Automation Conference (ASP-DAC)
  • 时间：2011
  • 成果类型：会议
  • 相关项目：面向异构多核微体系结构的物理规划研究
作者： Wang, Kan|Ma, Yuchun|Dong, Sheqin|Wang, Yu|Hong, Xianlong|Cong, Jason|
同会议论文项目
面向异构多核微体系结构的物理规划研究
期刊论文 7 会议论文 16 专利 4
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