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Micro-BGA package reliability
  • 所属机构名称：上海交通大学
  • 成果类型：会议
  • 相关项目：面向芯片封装的高速运动系统的精度定位和操纵
作者： Gao JG, Wu YP, Ding H
同会议论文项目
面向芯片封装的高速运动系统的精度定位和操纵
期刊论文 13 会议论文 209 著作 8
同项目会议论文
芯片封装运动平台控制和视觉对准
Phase regression approach for
A Point correlation based sub-
基于弹性体约束的高性能IC封装工
Study of Several Key Reliabili
Laser Soldering System Calibra
基于弹性体约束的高性能IC封装工
Robust internal model control
Dynamic Modeling and active vi
A machine vision system of bal
Micro-BGA package reliability
面向芯片封装的高加速度运动系统
高性能运动系统的宽频多模态耦合
Lie theoretical approach to sy
Evaluation of a double-layer a
A machine vision system of bal
Study of Several Key Reliabili
芯片封装运动平台控制和视觉对准
Robust internal model control
Adaptive switching control met
Vibration suppression of flexi
Laser Soldering System Calibra
A Virtual Prototyping Approach
Dynamic Modeling and active vi
A reflow doldering retro-desig
面向芯片封装的高速高精运动平台
Motion Control of Electronic P
芯片封装运动平台控制和视觉对准
IP Sensor and Its Distributed
Design and optimization of het
Study on Design Mechod and App
Optimal measurement point plan
Open architecture controller d
Vibration suppression of rotat
Lie theoretical approach to sy
New challenges in design and u
Experimental and Numerical Ana
Nonlinear friction compensatio
Fast positioning technology of
基于弹性体约束的高性能IC封装工
Iterative learning variable st
面向芯片封装装备的精密定位和控
电子封装运动平台的设计与控制
Experimental Optimization of P
Vibration suppression of flexi
电子封装运动平台的设计与控制
高性能运动系统的宽频多模态耦合
A Virtual Prototyping Approach
Vibration suppression of rotat
Adaptive switching control met
New challenges in design and u
IP Sensor and Its Distributed
面向芯片封装装备的精密定位和控
A variational method for struc
高性能运动系统的宽频多模态耦合
Thermal and mechanical loading
Iterative learning variable st
A variational method for struc
Optimal measurement point plan
Open architecture controller d
Nonlinear friction compensatio
Vibration suppression of rotat
Experimental Optimization of P
面向芯片封装的高加速度运动系统
Design and optimization of het
Study on Design Mechod and App
A reflow doldering retro-desig
Motion Control of Electronic P
Fast positioning technology of
面向芯片封装的高速高精运动平台
Packaging technology in Therma
电子封装运动平台的设计与控制
IP Sensor and Its Distributed
Experimental and Numerical Ana
Uncertainty analysis and model
面向芯片封装装备的精密定位和控
电子封装运动平台的设计与控制
芯片封装运动平台控制和视觉对准
Dynamic Modeling and active vi
Study of Several Key Reliabili
Lie theoretical approach to sy
Phase regression approach for
Study of Several Key Reliabili
Thermal and mechanical loading
Micro-BGA package reliability
Uncertainty analysis and model
A variational method for struc
Phase regression approach for
Optimal measurement point plan
Motion Control of Electronic P
Uncertainty analysis and model
Iterative learning variable st
Packaging technology in Therma
Design and optimization of het
Quantitative Reliability Estim
Study on Design Mechod and App
高性能XY工作台的ADAMS刚柔耦合
Lie theoretical approach to sy
面向芯片封装的高加速度运动系统
Evaluation of a double-layer a
Micro-BGA package reliability
面向芯片封装的高速高精运动平台
Design and optimization of het
Study on Design Mechod and App
Optimal measurement point plan
Optimal measurement point plan
Motion Control of Electronic P
Uncertainty analysis and model
Iterative learning variable st
Packaging technology in Therma
Design and optimization of het
Quantitative Reliability Estim
Study on Design Mechod and App
高性能XY工作台的ADAMS刚柔耦合
Lie theoretical approach to sy
面向芯片封装的高加速度运动系统
Evaluation of a double-layer a
Micro-BGA package reliability
面向芯片封装的高速高精运动平台
Design and optimization of het
Study on Design Mechod and App
Optimal measurement point plan
Packaging technology in Therma
Design and optimization of het
Quantitative Reliability Estim
Study on Design Mechod and App
面向芯片封装的高加速度运动系统
Evaluation of a double-layer a
Micro-BGA package reliability
面向芯片封装的高速高精运动平台
Design and optimization of het
Study on Design Mechod and App
Optimal measurement point plan
Optimal measurement point plan
Motion Control of Electronic P
Uncertainty analysis and model
Iterative learning variable st
Packaging technology in Therma
Design and optimization of het
Quantitative Reliability Estim
Study on Design Mechod and App
高性能XY工作台的ADAMS刚柔耦合
Lie theoretical approach to sy
面向芯片封装的高加速度运动系统
Evaluation of a double-layer a
面向芯片封装的高速高精运动平台
New challenges in design and u
Quantitative Reliability Estim
A Point correlation based sub-
面向芯片封装装备的精密定位和控
面向芯片封装的高加速度运动系统
高性能运动系统的宽频多模态耦合
A variational method for struc
Design and optimization of het
高性能XY工作台的ADAMS刚柔耦合
Vibration suppression of rotat
面向芯片封装的高速高精运动平台
Motion Control of Electronic P
基于弹性体约束的高性能IC封装工
Open architecture controller d
New challenges in design and u
A Point correlation based sub-
Micro-BGA package reliability
Adaptive switching control met
Laser Soldering System Calibra
Experimental and Numerical Ana
Study on Design Mechod and App
Nonlinear friction compensatio
A Virtual Prototyping Approach
Packaging technology in Therma
Optimal measurement point plan
Uncertainty analysis and model
A machine vision system of bal
Experimental Optimization of P
Iterative learning variable st
A reflow doldering retro-desig
Quantitative Reliability Estim
Thermal and mechanical loading
Fast positioning technology of
Robust internal model control
Vibration suppression of flexi
IP Sensor and Its Distributed
Evaluation of a double-layer a
Robust internal model control
A Virtual Prototyping Approach
Quantitative Reliability Estim
Thermal and mechanical loading
A machine vision system of bal
Fast positioning technology of
Experimental Optimization of P
Dynamic Modeling and active vi
Nonlinear friction compensatio
A Point correlation based sub-
Open architecture controller d
Experimental and Numerical Ana
Phase regression approach for
A reflow doldering retro-desig
Packaging technology in Therma
Vibration suppression of flexi
Evaluation of a double-layer a
Adaptive switching control met
Laser Soldering System Calibra
Optimal measurement point plan
Motion Control of Electronic P
Uncertainty analysis and model
Iterative learning variable st
高性能XY工作台的ADAMS刚柔耦合
Lie theoretical approach to sy