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Design of Pb-free solders in electronic packaging by computational thermodynamics and kinetics
  • 所属机构名称：厦门大学
  • 会议名称：国际，口头报告，ISPD国际相图与组织控制会议，2005年6月，沈阳
  • 成果类型：会议
  • 相关项目：金属材料的合金设计原理
同会议论文项目
金属材料的合金设计原理
期刊论文 60 会议论文 52
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Development of a Materials Design Tool and Its application in Pb-free Micro-solders in Electronic Pa
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Development of a Materials Design Tool and Its application in Pb-free Micro-solders in Electronic Pa
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Thermodynamic reassessment of the Mg-Y-X-(Al,Zn) systems
Thermodynamic assessment of phase equilibria in the Sn-Ag-X (Au, Ni) system
Thermodynamic assessment of Co-Th and Fe-Th systems
Thermodynamic assessment of Co-Sc and Fe-Sc systems
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利用亚稳奥氏体钢的应力诱发马氏体相变及逆相变制备纳米晶粒金属材料
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Thermodynamic modeling of the Ce-Zn and Al-Zn-Ce systems
Thermodynamic assessment of Cu-Th and Mo-Th systems
Thermodynamic Calculation of Phase Equilibria in the Sn-Ag-Cu-Ni-Au System
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Design of development of the self-assemble Cu-Fe base composites
Experimental determination and thermodynamic calculation of the phase equilibria in the Co-Mo-W syst
Phase field simulation of the egg-type microstructure evolution in Fe-Cu alloy
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多尺度材料设计的研究现状和发展趋势