位置：成果数据库 > 会议 > 会议详情页
Thermal performance of microchannels with dimples for electronics cooling
  • 所属机构名称：中国石油大学（华东）
  • 会议名称：ASME 2013 4th International Conference on Micro/Nanoscale Heat and Mass Transfer, MNHMT 2013
  • 时间：2013
  • 成果类型：会议
  • 相关项目：高功率密度芯片微流道冷却的基础研究
同会议论文项目
高功率密度芯片微流道冷却的基础研究
期刊论文 16 会议论文 24
同项目会议论文
Heat transfer enhancement on micro-channel heat sink for thermal management of electronic devices
金属泡沫平板结构内的对流换热的数值研究
多孔金属几何布置对热沉流动与传热影响的数值研究及场协同分析
周期性温度边界条件下多孔材料的局部非平衡热响应研究
矩形柱鳍结构对微通道热沉内流动传热的影响及场协同分析
表面微结构对微尺度强化传热流动减阻的影响
Discussion on Conditions of Local Thermal Non-Equilibrium Effect In Porous Media
微通道中球窝与凸起模型的流动换热比较
双层流道热沉内流体流动换热研究及热应力分析
Thermal Transport Analysisin Metal Foam Heat Sink with LTE and LTNE Models
Lattice BoltzmannSimulation of Conjugate Heat Transfer in a rectangular channel with fins
高功率密度芯片微流道冷却的基础研究
Thermal performance analysis of bi-porous metal foam heat sink
Numerical Study on Geometric Features of Microchannel Heat Sink with Slot Structure
金属泡沫内纳米流体强化传热研究
Numerical Study on the Effects of Micro-channel Heat Sink Layout for Electronics Cooling
Accessment of Three Coalescence And Breakage Kernel Models On Predicting Complex Bubbly Flow
Numerical Studies on Geometric Features of Microchannel Heat Sink with Pin Fin Structure
微小流道热沉布置对电子器件冷却影响的数值研究
The characteristics of fluid flow and heat transfer in wavy, dimple and wavy-dimple microchannels
Parametric Numerical Study of Flow and Heat Transfer in Microchannels with Dimples
Parametric Numerical Study of the Flow and Heat Transfer in Wavy Microchannel with Dimples
金属泡沫微通道热沉与普通微通道热沉冷却性能的对比研究