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Hygrother-mal mechanical analysis of a Flip Chip Package by finite element method
  • 所属机构名称：太原理工大学
  • 会议名称：The 5th International Conference on Nonlinear Mechanics (ICNM-V)
  • 成果类型：会议
  • 会场：Shanghai, China
  • 相关项目：无铅焊料电子封装芯片动力失效模式及相关力学问题的实验与理论研究
作者： Niu Xiaoyan, Li Zhigang, Yuan Guozheng, Shu Xuefen|
同会议论文项目
无铅焊料电子封装芯片动力失效模式及相关力学问题的实验与理论研究
期刊论文 9 会议论文 12
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