Effect of dummy vias on interconnect temperature variation
- ISSN号:1001-246X
- 期刊名称:《计算物理》
- 时间:0
- 分类:TN402[电子电信—微电子学与固体电子学] TN47[电子电信—微电子学与固体电子学]
- 作者机构:[1]School of Microelectronics, Xidian University, Xi 'an 710071, China, [2]Huaxun Microelectronics Corporation, Xi 'an 710075, China
- 相关基金:Project supported by the National Natural Science Foundation of China (Nos. 60725415 and 60971066) and the National High-Tech R & D Program (863) of China (Nos. 2009AA01Z258 and 2009AA01Z260),Acknowledgements We thank the Huaxun Microelectronic Corporation and its President, Wen-yi ZHOU, for the system design and GPS receiver chip test, and Xiang-shun SHEN, Le LI, Yang LUO, Guo-liang ZHAO, Hai-feng LV for some block designs and for the layout of the chip.
中文摘要:
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