中文摘要：

采用酸性化学镀技术在Al2O3陶瓷片表面沉积Ni—P镀层，通过电感耦合等离子体发射光谱，x射线衍射光谱和扫描电子显微镜等分析测试，对镀层的成分、物相和形貌进行了表征，考察了表面活性剂种类、掺量等因素对镀层表面性貌和性能的影响。结果表明，当添加5mg·L^-1SDS时，镀速从14μm·h^-1增加到17μm·h^-1，随表面活性剂添加量继续增加，镀速呈减少趋势。添加表面活性剂能够不同程度的消除化学镀Ni-P镀层固有的胞状组织，提高表面致密性和平整性：镀层自腐蚀电流密度从43μA·cm^-2减小至3．5μA·cm^-2，镀层的耐腐蚀性能显著提高。根据电化学理论和实验规律，探讨了表面活性剂在化学镀镍磷合金反应过程的影响机理。

英文摘要：

N-P coatings were deposited on Al2O3 ceramic by electroless plating and characterized by XRD, SEM and induced coupled plasma （ICP-OES）. The effects of three surfactants in the electroless plating such as CTAB （Cetyl Trimethyl Ammonium Bromide）, SDS （Sodium Dodecyl Sulfonate） and Tween-20 were investigated. The results show that the deposition rate of the coatings increases with a small amount of surfactants whereas it decreased with more surfactants. And the concentration of phosphor in the coatings decreases with the addition of surfactants. The addition of 5 mg· L^-1 of CTAB eliminates the cell structure of traditional Ni-P coatings and improves the uniformity of the coatings. And the Iorr of the coatings decreased from 43 μA· cm^-2 to 3.5μA· cm^-2 which indicated a better anticorrosion property. Based on the investigation of the experimental parameters,the effects of surfactants in the reaction process of electroless plating Ni-P coatings were analyzed according to the electrochemistry theory.