中文摘要：

采用循环伏安、方波伏安、计时电位及线性扫描伏安法研究了500℃时Cu（Ⅰ）在LiCl-KCl熔盐体系中石墨电极和钼电极上的电化学行为,并且研究了不同CuCl浓度下铜的沉积电位。结果显示,铜离子在熔盐中的还原过程分两步进行,分别在-1.05 V和-1.55 V处依次还原,即Cu（Ⅱ）→Cu（Ⅰ）和Cu（Ⅰ）→Cu（0）。通过循环伏安及计时电位测试,均得出Cu（Ⅰ）在LiCl-KCl熔盐中的阴极还原过程为受扩散控制的准可逆过程,扩散系数分别为1.79×10^-5 cm^2/s和1.26×10^-5 cm2/s。

英文摘要：

The electrochemical behavior of Cu（Ⅰ）in eutectic LiCl-KCl（58.5∶41.5 mol ratio）melt was investigated on graphite and Mo electrodes at 500 ℃ by cyclic voltammetry,square wave voltammetry,chronopotentiometry,and linear sweep voltammetry.The cathodic peak currents and initial deposition potentials of copper under different concentrations of CuCl were obtained.The results show that two initial reduction potentials of copper ions are obtained at-1.05Vand-1.55 Von graphite electrode,which correspond to Cu（Ⅱ）/Cu（Ⅰ）,and Cu（Ⅰ）/Cu（0）couples,respectively.Reduction of Cu（I）is a quasireversible process controlled by diffusion mass transfer.The diffusion coefficients of Cu（Ⅰ）,calculated by the results of cyclic voltammetry and chronopotentiometry,is 1.79×10^-5 cm^2/s and 1.26×10^-5 cm^2/s,respectively.