研究了深过冷条件下三元Ni80Cu10Co10合金的快速枝晶生长,采用电磁悬浮无容器处理方法获得了335K(0.2TL)的最大过冷度,X射线衍射分析与差示扫描量热分析均表明,凝固组织为α-Ni单相固溶体,随过冷度增大,凝固组织显著细化,并且当过冷度达110K时,凝固组织的形态由粗大形枝晶转变为等轴晶。深过冷条件下溶质截留效应增强,使得微观偏析程度减小,对不同过冷度下合金枝晶的生长速度进行了实验测定,当过冷度超过284K后。生长速度呈现下降趋势,在大过冷度时,Cu和Co溶质元素的引入,显著降低了Ni80Cu10Co10合金的枝晶生长速度。
Rapid dendritic growth in undercooled liquid Ni80Cu10Co10 alloy has been investigated. This liquid ternary alloy was undercooled by a large degree up to 335 K(0.2 TL) with electromagnetic levitation method. The rapidly solidified microstructure is revealed to be α-Ni solid solution phase by X-ray diffraction and differential scanning calorimetry. With the increase of undercooling, the microstructure is drastically refined. Its morphology transfers from coarse dendrite into equiaxial grains when undercooling exceeds 110 K. The solute microsegregation is suppressed with the enhancement of solute trapping effect under high undercooling condition. The dendritic growth velocity was measured as a function of undercooling. At extremely large undercoolings, the dendritic growth velocity of α-Ni phase is restrained by the solute diffusion of Cu and Co, and even decreases once undercooling exceeds 284 K.