欢迎您！东篱公司
退出
-
申报数据库
-
立项数据库
-
成果数据库
-
项目获奖数据库
中文摘要：
在半导体硅片（Si）-扩散阻挡层（Ni—Cr合金）-金属互连材料（Cu）构成的体系中，Si和Ni-Cr合金之间以及Ni-Cr合金和Cu之间各构成一对扩散偶．通过制备扩散偶试样模拟相应的界面反应，实验测定950℃下界面反应产物的表观序列．从热力学的角度，分别对Cr-Ni—Si和Cr-Cu—Ni三元系中Si／（Ni-Cr）和（Ni-Cr）／Cu两个界面进行反应驱动力分析．计算获得的阶段性生成相表观序列与实验测得结果一致．
英文摘要：
In a system consisted of semiconductor silicon wafer （Si）, diffusion resistant layer （Cr-Ni alloy） and metal contact material （Cu）, diffusion couples were formed at Si/（Cr-Ni） and （Cr-Ni）/Cu, respectively. The phases formed due to interracial reactions in both the diffusion couples were investigated experimentally and the apparent phase contact sequences were obtained at 950℃. Based on phase equilibrium calculations of the Cr-Cu-Ni and the Cr-Ni-Si ternary systems, the phase formation driving forces for interfacial reactions of the diffusion couples were analyzed theoretically. The step-by-step phase formation sequences were obtained to simulate microstructure evolutions in the diffusion couples. The thermodynamic predictions are in accord with the experimental observations.
位置：
同期刊论文项目
