中文摘要：

采用硅氧偶联剂（3-氨丙基二甲氧基硅烷）化学改性,铜种晶选择性定位以及铜的化学镀沉积的方法成功在柔性纤维素纸基体上得到高导电性金属图形。其中,铜的活化过程可以分为铜离子的吸附和直写硼氢化钠墨水还原为铜金属种晶两个过程。运用红外光谱（FTIR）和X射线光电子能谱分析（XPS）分析得出经过化学改性之后,纸基体的表面发生了氨基化反应,成功在纸基体上嫁接上了伯胺基团。运用扫描电子显微镜（SEM）表明了在纸和金属图形之间清晰的界面,用Scotch胶带方法测试金属和纸张粘附性,发现纸张与金属结合牢固无法分开。X射线衍射（XRD）分析得出所得到的金属图形纸表面的金属是铜,并且具有（1 1 1）的择优晶面取向,具有良好的抗电子迁移性能。四探针电阻仪表明纸表面的金属具有非常好的导电性（10.3μΩ·cm）。

英文摘要：

Highly conductive metal pattern was successfully obtained by the silicone coupling agent （3-aminopropyltrimethoxysilane） chemical modification method combined with selective copper electroless deposi- tion on flexible cellulose paper substrate. Among them, the activation process of copper can be divided into two processes including the adsorption of copper ion and the direct writing of sodium borohydride ink to re- store the copper metal seeding. Fourier transform infrared spectroscopy （FTIR） and X-ray photoelectron spectroscopy （XPS） analysis showed that after chemical modification, the amination reaction occurred on paper substrate and the primary amine group was successfully grafted on the paper surface. A clear boundary between metal and paper substrate was confirmed by scanning electron microscopy （SEM）. Scotch tape test method demonstrated so good adhesion between metal and paper that paper and metal cannot be separated. XRD analysis showed that the obtained Cu patterns had a structure with Cu （111） preferred orienta- tion, revealing an excellent eleetromigration resistance. The resistivity of copper patterns characterized by the digital four-point probe was 10.3μΩ·cm.