中文摘要：

当多个LED密集排列组成大功率照明系统时,散热问题成为影响LED灯发光性能的主要技术瓶颈之一,因此解决散热问题已成为功率型LED应用的先决条件。本文将功能化石墨烯与硅树脂复合制备出了低填充量高导热性能的石墨烯/硅树脂复合材料。石墨烯（Graphene）填充质量分数为0.015时,复合材料的热导率高达2.758 W/（m.K）,比纯硅脂基体提高了13倍;添加石墨烯后明显改善了硅树脂的热稳定性。将该复合材料作为热界面材料应用于大功率LED芯片模组基板与灯具冷却外壳之间的散热,能获得很好的增强效果,结果表明石墨烯填充质量分数仅为0.008时,基板与外壳之间的温度差可达到小于5℃,满足大功率LED灯具的散热要求。

英文摘要：

When a large quantity of LED chips are intensively arrayed to form a high-power illuminating system,the problem of heat-dissipation becomes one of the main technical bottlenecks that affect LED luminous performance.Therefore,to solve the problem of heat-dissipation is the necessary prerequisite of application of high-power LED.In this paper,highly thermally conductive graphene/resin composite with low concentration is prepared with functional graphene and silicone resin.The thermal conductivity reaches 2.758 W/（m·K）that is a 13-fold increase over neat silicone when the weight fraction is 0.015.Otherwise,it is graphene added that improves the thermal stability of silicone.The composite is applied in heat dissipation as thermal interface material between LED chip module substrate and cooling shell,having a excellent effect.The result indicates that a temperature gap between heat slug and heat sink is less than 5℃,meeting a requirement in the heat-dissipation of high-power LED,when the weight fraction of graphene is 0.008.