中文摘要：

采用垂直直流电场，研究了EDTA施入到土壤后，在不同电场方向和强度下土壤Cu，Zn络合物在土柱中的迁移过程。结果表明，电场作用影响土壤中Cu，Zn络合物的迁移，电场强度越大，对络合物的迁移作用越显著．在阳极在上的电场环境下，电场作用能够有效减缓Cu，Zn络合物向下迁移，改变电场方向后，电场作用则能加速Cu，Zn络合物的向下迁移聚积，与对照相比，电场作用改变了土壤Cu，Zn在土柱中的分布，对土壤性质的影响主要集中在电极附近。

英文摘要：

The migration process of Cu, Zn complex in a soil column of different eclectic field direction and strength after input of EDTA in the soil was studied, adopting vertical electric field. The electric field action influenced the migration behaviors of Cu, Zn complex in the soil; and the greater the field strength, the more marked the migration action of Cu, Zn complexes. Under the electric field environment with upper anode, the field action could low down effectively the downward migration of the complexes; after changing the field direction, its action could accelerate the complexes migrating downward. Compared with contrast, the field action changed the distribution of soil Cu, Zn in the soil column entirely with its influence on soil quality accumulated mainly near the electrode.