中文摘要：

针对先进纳米铜互连技术的要求，研究了脉冲电流密度对铜互连线电阻率、晶粒尺寸和表面粗糙度等性能的影响。实验结果表明，2～4A／dm^2电流密度下的铜镀层拥有较小电阻率、较小的表面粗糙度和较大的晶粒尺寸。

英文摘要：

Aiming at the technology demand of advanced copper interconnection, the effect of pulse current density on Cu layer properties such as resistance, crystal size and surface roughness were investigated. The results showed that when current density was 2-4 A/dm^2, the electrodeposited layer had lower resistance, lower surface roughness and larger crystal size.